EIA/JESDAB. Page 1. TEST METHOD AB. POWER AND TEMPERATURE CYCLING. (From Council Ballot JCB, formulated under the. Find the most up-to-date version of JESDAA at Engineering 4. Power Temp. Cycling. (PTC) JESDA /+°C, If = 20mA on/off = 5min. hrs. 5. Steady state life test. (SSLT) JESDA

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It is intended for device qualification.


I rec ommen d cha nges to the fo llow in g: Ramp rate can be load dependent and should be verified for the load being tested. During the test, the power applied to the devices shall be alternately cycled 5 minutes on 5 minutes off unless otherwise specified in the applicable specification. Effect of YMnO3 on the The power should then be applied and suitable checks made to assure that all devices are properly biased. Power supplies and biasing networks shall be capable of maintaining the specified operating conditions throughout the testing period despite normal variations in line voltages or ambient temperatures.

If the test is interrupted as a result of power or equipment failure, the test may restart from the point of stoppage. Sockets or other mounting means shall be provided within the chamber so that reliable electrical contact can be made to the device terminals in the specified circuit configuration.

The device shall be subjected to the test conditions derived from Table 1 as illustrated in Figure 1. The test circuitry should also be designed so that existence of abnormal or failed devices does not alter the specified conditions for other units on test.

The electrical measurements shall consist of parametric and functional tests specified in the applicable specification.


Samples with large thermal jeesd22 and low heat transfer efficiency require ramp rates slow enough to compensate for the thermal mass.


It is intended to simulate worst case conditions encountered in typical applications. When testing these devices it is important to avoid transient thermal gradients in the samples on test. If liquid nitrogen LN2 is used, care must be taken to avoid direct exposure of the parts and boards to the LN2. The time at the high and low temperature extremes shall be sufficient to allow the total mass of each device under test to reach the specified temperature extremes with no power applied.

JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.

Rec ommend a tions fo r cor rec tion: The low temperature to high temperature transition a15 reverse sequence is acceptable.

The power and temperature cycling test is considered destructive.

JESDAB – Test Method AB, Power and Temperature Cycling

Re qu ire men t, c la use n umber T es t me jexd22 nu mber C laus e number F a x: Care should be taken to avoid possible damage from transient voltage spikes or other conditions that might result in electrical, thermal, or mechanical overstress.

Mechanical damage shall not include damage induced by fixturing or handling or the damage is not critical to the package performance in the specific application. Direct heat conduction to sample s shall be minimized. O ther su gges tio ns for d ocu men t impro vemen t: A combined power and e No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. The devices shall concurrently be cycled between temperature extremes for the specified number of cycles.


The power and temperature jeesd22 test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes with operating biases periodically applied and removed.

Cycle ramp rate and soak time are more significant for solder interconnections. For samples without a thermal mass constraint, the ramp rate can be faster. JEDEC standards and publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes.

Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. The temperature of the sample should be within a few degrees of the ambient temperature during the temperature ramps.

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By downloading this file the individual agrees not to charge for or resell the resulting material. The power and temperature cycling test shall be continuous except when parts are removed from the chamber for interim electrical measurements. A combined power cycle IGBT Power cycling and Precautions should be taken to avoid electrical jfsd22 and thermal runaway. The test setup should be monitored initially and at the conclusion of a test interval to establish that all devices are being stressed to the specified requirements.

Deviations must be corrected prior to further cycling to assure the validity of the qualification data.

These include flip chip, ball grid array and stacked packages with solder interconnections. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. NOTE Power duty cycle is usually expressed as a percentage.

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